旁路二极管热性能测试系统
BR-PV-BDT Bypass Diode Thermal Test System
Implementation of standards:
IEC 61215:2005 & Ed.3, IEC 61646:2008, UL 1703-2008, VDE 0126-5:2008
System parts:
DC power supply: Voltage 0~50V, current 0~1, can Provide 1.25 timesIsc.
High temperature test chamber: RT~100°C, can into module
Data collector: Connecting to PC computer, automatic temperature and voltage data acquisition
Temperature rise glue: for adhesive thermocouple
A hand-held electric drill: for junction box borehole and export cable and thermocouple
Silica sealant and silica sealant gun: for Sealing
Ohm meter: for verify that the diode is still operational after 1.25 times Isc.
Computer: data analysis and processing
English operating software: automatic voltage and temperature data acquisition, then calculate diode junction temperature
