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Mica and Single Crystal Substrates Silicon Chip Specimen Supports云母和单晶衬底硅芯片样品支持

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  • Mica and Single Crystal Substrates Silicon Chip Specimen Supports
    云母和单晶衬底硅芯片样品支持
    Cleaving mica involves insertion of a sharp edge or point into an edge or corner of the sheet and gently prying apart the leaves. A good sharp razor blade edge will do the job and in some cases a sharp pointed tweezer may accomplish this.. The freshly exposed micro surface should be used immediately after cleaving to take advantage of the clean and even surface. The muscovite mica is die cut to the sizes offered. The thickness of the mica sheets varies between 0.18 - 0.25mm (0.007 - 0.01") which yields much thinner, uniform sheets. 
    Cleaving can also be achieved by placing a double coated piece of tape onto the mica surface and gently pulling off the mica layer starting on one edge of the mica. Then place mica with tape side down on to a specimen disc or mount.

    Ruby muscovite color ranges from almost white through pink to a light ruby and into shades of brownish ruby and brown. It is considered of higher quality (compared to green muscovite) because of hardness and excellent cleavage properties permitting it to be split into the thinnest desired film without the risk of cracking. It is optically flat, resilient and incompressible. While it splits into thin films along its cleavage planes, yet it remains tough and elastic, even at high temperatures.
    Chemically, mica is a complex hydrous silicate of aluminum, containing potassium, magnesium, iron, sodium fluoride and/or lithium and traces of other elements. It is stable and inert to water, acids (except hydrofluoric and concentrated sulfuric acids), alkalis, conventional solvents and oil.
    Our mica has minimum inclusions, minimum air and bubbles and is clean. ASTM D-351 describes grading standards for mica. 
     
    Mica Grades
    Mica grades from V-1 to V-5 with V-1 being the highest quality.
    V-1 Clear, hard, of uniform color, nearly flat, free from stains, foreign inclusions, cracks and other similar defects.
    V-2 Clear and slightly stained. May contain slight crystallographic discoloration and very slight air inclusions in one fourth of the usable area.
    V-3 Fair stained. Hard, of uniform color, may contain slight waves, slight crystallographic discoloration, and medium air inclusions in not more than one half of the usable area.
    V-4 Good stained. Hard, of uniform color, may contain medium waves. Slight crystallographic discoloration and medium air inclusions in not more than two thirds of the usable area.
    V-5 Stained A quality. Hard, may contain medium air inclusions, uniformly distributed in the usable area, slight green vegetable stains and medium waviness.
    Highest Grade Mica DisksHighest quality grade V1 mica, 0.21mm (.0085”) thick. Interleaved, in packages of 10.
    Available in four diameters:
    10mm (0.39")
    12mm (0.47")
    15mm (0.59")
    20mm (0.79")
    Prod # Description Unit
    50
    		Highest Grade V1 Mica Discs, 10mm
    pkg/10
    50-12
    		Highest Grade V1 Mica Discs, 12mm
    pkg/10
    50-15
    		Highest Grade V1 Mica Discs, 15mm
    pkg/10
    50-20
    		Highest Grade V1 Mica Discs, 20mm
    pkg/10
    Highest Grade Mica SheetsHighest quality Grade V1
    .15 to .177mm (.006-.007") thick
    Sheets interleaved
    Various sizes
    Prod # Description Unit
    56-15
    		Highest Grade V1 Mica, 15 x 15mm
    pkg/10
    56-25
    		Highest Grade V1 Mica, 25 x 25mm (1 x 1")
    pkg/10
    56
    		Highest Grade V1 Mica, 25 x 75mm (1 x 3")
    pkg/10
    56-75
    		Highest Grade V1 Mica, 50 x 75mm (2 x 3")
    pkg/10
    56-100
    		Highest Grade V1 Mica, 100 x 75mm (4 x 3")
    pkg/5
    Hi-Grade MicaGrade V2 
    0.23 to 0.3mm (.009 - .012") thick
    Sheets interleaved
    Various sizes
    Prod # Description Unit
    52-15
    		Hi-Grade Mica, Grade V2, 15 x 15mm
    pkg/10
    52-25
    		Hi-Grade Mica, Grade V2, 25 x 25mm (1 x 1")
    pkg/10
    52-6
    		Hi-Grade Mica, Grade V2, 25 x 25mm (1 x 1")
    pkg/20
    52-19
    		Hi-Grade Mica, Grade V2, 25 x 75mm (1 x 3")
    pkg/10
    52-75
    		Hi-Grade Mica, Grade V2, 50 x 75mm (2 x 3")
    pkg/10
    PELCO® Mica Sheets, Grade V5Various sizes available, presenting many fresh, clean surfaces for such EM applications as carbon filming and particle spraying. Thickness, .23mm (.009").
    Prod # Description Unit
    53-15
    		PELCO® Mica Sheets, Grade V5, 15 x 15mm
    pkg/10
    53-25
    		PELCO® Mica Sheets, Grade V5, 25 x 25mm (1 x 1")
    pkg/10
    54
    		PELCO® Mica Sheets, Grade V5, 10 x 40mm
    pkg/100
    53
    		PELCO® Mica Sheets, Grade V5, 25 x 75mm (1 x 3"),
    pkg/20
    52
    		PELCO® Mica Sheets, Grade V5, 50 x 75mm (2 x 3"),
    pkg/10
    Silicon Chip Specimen SupportsSi-chips are opaque, of low electrical resistance and have surface properties equal to glass (including smoothness). They are also good substrates for growing or mounting cells. Si-chips are precleaned before packaging. Also ideal for imaging small particles due to low background signal.

    Availability: 4" wafer is precut into 5x7mmm, 5x5mm or 10x10mm chips that can be easily separated in the laboratory. 

    4" wafer precut into 5x7mm chips approximately 187 chips/wafer.
    4" wafer precut into 5x5mm chips approximately 270 chips/wafer. 
    4" wafer precut into 10x10mm chips approximately 55 chips/wafer.

    Properties:
    Orientation: <111>
    Resistance: 1-30 Ohms
    Type: P (Boron) (1 primary flat)
    No SiO2 top coating
    Wafer thickness: 18-21 mil (460-530µm)
    Wafer is polished on one side
    Before dicing they are rinsed in de-ionized water for cleaning

    Prod # Description Unit
    16007
    		4" (10cm) dia., 5x7mm diced Silicon Wafer, 187 chips/wafer,
    each
    16008
    		4" (10cm) dia., 5x5mm diced Silicon Wafer, 270 chips/wafer
    each
    2", 3", 4" and 6" Silicon Wafers
    These 2", 3", 4" and 6" diameter silicon wafers can be used either as a substrate for thin film research or to make small silicon substrates by dicing the wafer into smaller pieces using a scriber and the Wafer Cleaving / Glass Breaking Pliers. The wafer is shipped in a wafer carrier. 

    Properties:
    Orientation <111> or <100> for 6" wafer
    Resistance: 1-30 Ohms
    Type P: (Boron) (1 primary flat)
    No SiO2 top coating
    Wafer thickness: 18-21 mil (460-530µm)
    Wafer is polished on one side
    Prod # Description Unit
    16012
    		Ø2" Silicon Wafer, Type P / <111>
    each
    16013
    		Ø3" Silicon Wafer, Type P / <111>
    each
    16010
    		Ø4" Silicon Wafer, Type P / <111>
    each
    16015
    		Ø6" Silicon Wafer, Type P / <100>
    each

     

     

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